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Nordson Solutions: The Key to Reliable and High-Performing Electronic Devices

Gulf Application Engineering and Packaging is proud to offer a wide range of cutting-edge solutions from Nordson, a global leader in advanced technology for the electronics manufacturing industry.





Nordson's range of products and services are designed to meet the demanding requirements of the semiconductor packaging, PCB & SMT assembly, Micro-electro-mechanical systems (MEMS), Life Science, Camera Module assembly, and Alternative Energy applications.


One of the key solutions provided by Nordson is their precision fluid dispensing technology. This technology is used to apply accurate and consistent amounts of adhesives, sealants, lubricants, and other assembly fluids used in virtually every manufacturing process. This is essential for protecting and strengthening the connections between semiconductor die and substrate, and for dissipating heat in electronic devices, thus ensuring maximum performance and reliability of the final product.


Another important solution is the use of Underfill, which is essential for protecting and strengthening the connections between semiconductor die and substrate. Nordson's Underfill Dispensing solution ensures precise and consistent application, ensuring maximum performance and reliability of the final product.

Conformal Coating Materials are also used to protect electronic components and PCBs from harsh environmental conditions, and Nordson provides solutions that ensure accurate and efficient coating of the materials while reducing overspray and material waste.


Thermal Interface Material (TIM) is a critical component for dissipating heat in electronic devices, and Nordson TIM dispensing solutions ensure precise and consistent application for optimal performance and reliability.

Encapsulant is used for protecting sensitive electronic components, and Nordson Encapsulant dispensing solutions provide precise and consistent application of the material for maximum protection.


Two-Component Materials, such as epoxy, are commonly used for bonding and sealing in electronic applications. Nordson's two-component dispensing solutions ensure precise mixing and dispensing for strong, reliable bonds.

Solder Paste Dispensing is an essential step in the SMT assembly process, and Nordson Solder Paste dispensing solutions deliver precise and consistent solder paste deposits, ensuring strong, reliable connections.


In addition to Nordson solutions, Gulf Application Engineering and Packaging also distributes a wide range of products and services from other top industry brands, including STS Brandschutz, HangOn, Comarme, Domino Printing, IDENTCO, Intrex, Alpha-Cure, Heller Industries, KYZEN, Universal Instruments, Indium Corporation, MYTORQ, HumiSeal, Resin Designs, Fratelli Zucchini and Matthes.

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