
Nordson AXM XM8000™
The complete solution for operator free, automated X-ray wafer metrology. Nordson XM8000™ is specifically designed for inline use in clean room environments.
Overview
This platform takes the market-leading capabilities from Nordson Test & Inspection's existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The Nordson XM8000™ provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 can be used as an integral part of the fabrication and packaging of integrated circuits or as part of quality control and product acceptance.
Product Video
Technical Specifications
For more information refer to the datasheet (XM8000 - 5) & (XM8000 - 7)
Technical specifications may vary depending on the selected configuration. Please contact us for detailed specifications tailored to your requirements.